Intelligent, direct-to-chip liquid cooling: lower power consumption and higher thermal efficiency
Over the past decades, the continuous increase in integrated circuit (IC) power density due to the ever-increasing rate of data and communications (AI, VR, ML, IoT, 5G, etc.), coupled with advanced fabrication and packaging technologies in micro- and nano-electronic systems have significantly improved chip performance. However, the inability to follow Dennard’s scaling law has incurred …